Solaris Wafers' process for manufacturing silicon wafers has many significant advantages
Low Cost
Compared to producing wafers by slicing ingots with wire saws or producing kerfless wafers by current kerfless methods, Solaris Wafers, LLC is confident that we can be the lowest cost producer of silicon wafers in the U.S. due to low CAPEX, low labor requirements and avoidance of large losses of silicon that occur during slicing of ingots.
High Productivity
The Solaris Wafer, LLC wafer process has a 10X greater manufacturing productivity and 50% fewer wafer manufacturing steps, requiring only 10% of the capital and 10% of the labor compared to producing wafers from cast ingots.
Utility-Scale Power Generation
One Solaris Wafers, LLC caster will produce 276 million kerfless wafers per year for cells and solar modules to generate an annual electric power of 1.4 gigawatts.
Significantly Less Silicon Waste
Kerfless wafers, produced by Solaris Wafers, LLC avoids a 40% loss of high purity silicon caused by slicing wafers from ingots with wire saws.
Wafer Size & Thickness
Solaris Wafers, LLC wafer process can cast any commercial wafer size M0 to M12 (156 mm to 210 mm square) or any thickness up to 200 microns.
Drop-in Substrate
Wafers from Solaris Wafers, LLC can be “drop-in” replacements for fabricating passivated emitter and rear cells (PERC), advanced heterojunction solar cells or be used as a low-cost substrate for bifacial perovskite/silicon tandem cells.